提供固晶机、焊线机、封胶机、测试机等专用设备及原装/替代备件，适配主流机型，运行稳定，降低运维成本。
Supply die bonders, wire bonders, molding machines, testers and spare parts with stable performance.
键合丝、导电胶、封装树脂、切割胶带、陶瓷基座、散热材料等，满足各类封装工艺精度与稳定性要求。
Bonding wires, adhesives, encapsulants, tapes, bases and thermal materials for packaging.
半导体设备用高精度金属、陶瓷、工程塑料零部件定制加工，尺寸精度高，表面质量优良，适配高端精密装配。
High-precision custom parts for semiconductor equipment with tight tolerance and fine surface.
提供工艺优化、设备安装调试、故障维修、操作培训、产线规划与升级改造等全方位技术支持。
Process optimization, debugging, maintenance, training and production line upgrade service.