提供固晶、焊线、封胶等专用设备及原装、替代备件，保障产线稳定运行
Provide die bonder, wire bonder, molding machine and reliable spare parts
键合丝、封装胶、切割胶带、陶瓷基座等全流程工艺配套材料
Bonding wires, encapsulants, dicing tapes, ceramic bases and more
高精度金属、陶瓷零部件定制加工，满足半导体设备高精密装配需求
High-precision custom parts for semiconductor equipment
工艺优化、设备调试、维修、培训及产线升级改造全方位技术支持
Process optimization, debugging, training and line upgrade service